Photonic chip packaging can withstand extreme environments

Photonic chip packaging can withstand extreme environments

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits—tiny chips that convey information using light instead of electricity—so they can survive and operate in extreme environments, from scorchingly hot industrial settings to ultracold vacuum chambers and the depths of outer space.

NIST Develops Photonic Chip Packaging For Extreme Environments

NIST researchers developed a new process for packaging photonic integrated circuits, allowing operation in environments from deep space to nuclear reactors. The technique ensures these chips survive extreme temperatures, including those near absolute zero.