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onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era
The platform is designed to deliver up to 4x higher power density and 15% lower losses for smaller, more efficient systems, onsemi said.
- On Wednesday, September 16, 2026, Scottsdale-based onsemi unveiled the Embedded Power Platform , a wafer-level architecture designed to increase power density for AI and electric vehicle applications.
- Traditional power design treats electrical, thermal, and mechanical engineering as separate challenges, limiting efficiency and forcing late-stage design trade-offs. EPP integrates these layers into a common platform to address growing power demands in compact systems.
- By using the wafer as the package, silicon, silicon carbide, and gallium nitride can be "seamlessly" interconnected, enabling up to 4x higher power density and 15% lower power losses compared to conventional approaches.
- Subaru Corporation has joined as an early partner, gaining access to engineering samples and technical expertise. Onsemi expects to sample strategic customers this year, with general availability targeted for Q1 2027.
- AI data center racks currently consume roughly 60kW, but capacity needs are expected to reach 1MW by the end of the decade. EPP aims to help customers manage this power surge within existing rack footprints.
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Why Onsemi (ON) Stock Dropped 9% Despite Launching Its Most Advanced Power Chip Yet
TLDR Onsemi stock fell 9% on Wednesday after its Investor Day failed to impress investors. The company unveiled its new Embedded Power Platform, claiming 3-5x higher power density than current solutions. Subaru is an early partner testing the platform for future electric vehicle architectures. The...
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Leaning Left4Leaning Right2Center3Last UpdatedBias Distribution45% Left
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45% Left
L 45%
C 33%
R 22%
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