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Odisha to Break Ground on India's First Advanced 3D Chip Packaging Unit
The Rs 1,934 crore project is expected to produce 70,000 glass panels a year and create about 2,500 jobs, officials said.
- Odisha Chief Minister Mohan Charan Majhi and Union IT Minister Ashwini Vaishnaw laid the foundation stone for India's first advanced 3D chip packaging unit in Bhubaneswar, marking a major expansion of the state's electronics manufacturing sector.
- The project, implemented by US-based 3D Glass Solutions Inc through Heterogeneous Integration Packaging Solutions Pvt Ltd, received approval under the India Semiconductor Mission last year with a Rs 1,934 crore investment.
- Funded by Intel, the facility is expected to produce 70,000 glass panels and 50 million assembled units annually, with CEO Lip-Bu Tan attending the ceremony virtually.
- Vaishnaw called the groundbreaking a "historic" day for Odisha, noting the project shifts the state away from traditional industries toward high-tech manufacturing while generating around 2,500 direct and indirect jobs.
- Unlike traditional silicon, 3D glass technology offers superior radio frequency performance and thermal stability, with the plant set to produce around 13,000 advanced 3DHI modules supporting India's semiconductor sector.
17 Articles
17 Articles
Odisha gets 3D chip packaging unit
Odisha is emerging as a significant player in advanced sectors like electronics and semiconductors with the inauguration of India's first 3D glass substrate packaging facility. This Rs 1,943 crore project, set up by 3D Glass Solutions Inc., aims to bolster India's semiconductor value chain and support future technologies like AI and high-performance computing.
digitimes.com
technewstube.comOdisha to break ground on India's first advanced 3D chip packaging unit
Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous integration capacity in South Asia, attracting investment for aerospace, defense, artificial intelligence (AI), 5G, and data center applications, and creating jobs.
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