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Nvidia's Cowos Demand Will Increase Sharply with Blackwell and Rubin Ai Products

Summary by igor´sLAB
According to UBS, demand for TSMC's CoWoS (Chip-on-Wafer-on-Substrate) packaging technology will experience a significant increase in 2026. This is primarily due to NVIDIA's current Blackwell AI chips and upcoming Rubin products. The company has already begun preparing its supply chain to meet the growing demand for AI hardware, which will be available after several […] Source
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igor´sLABigor´sLAB

Nvidia's Cowos Demand Will Increase Sharply with Blackwell and Rubin Ai Products

According to UBS, demand for TSMC's CoWoS (Chip-on-Wafer-on-Substrate) packaging technology will experience a significant increase in 2026. This is primarily due to NVIDIA's current Blackwell AI chips and upcoming Rubin products. The company has already begun preparing its supply chain to meet the growing demand for AI hardware, which will be available after several […] Source

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igor´sLAB broke the news in on Sunday, October 12, 2025.
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