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New active liquid cooling tames extreme chip heat in data centers

Global electronics and connectivity leader Molex is investing in CAEPlus, a thermal management startup, to advance an active liquid cooling platform designed to handle the rising heat generated by next-generation AI and high-performance computing systems. The funding will help CAEPlus develop BoundaryCool, a system that pulls heat away from graphics processing units (GPUs), central processing units (CPUs), and tensor processing units (TPUs) usin…

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IT Brief AsiaIT Brief Asia
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Molex backs CAEPlus cooling tech for AI data centres

Pressure is mounting on data centre operators as AI workloads push chip temperatures higher and make liquid cooling more urgent.

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Post Alley broke the news on Monday, August 17, 2026.
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