Monolithic 3D Silicon Chips Achieve Near-Perfect Yields At Low Temperatures

Silicon stacking breakthrough: The chip industry’s upward escape from Moore’s law

The semiconductor industry has spent decades chasing smaller transistors, squeezing ever more components onto flat silicon wafers until hitting a wall built by the laws of quantum mechanics. But researchers at the University of Illinois Urbana-Champaign have developed a way to stack high-performance silicon circuits directly on top of one another, and their process achieves near-perfect yields at temperatures low enough to finally make monolithi…

Monolithic 3D Silicon Chips Achieve Near-Perfect Yields At Low Temperatures

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3D silicon circuits bring denser computer chips closer to reality

By stacking transistors on top of one another, rather than laying them side by side on a flat chip, many electronic engineers are hopeful that vast amounts of computing power could be packed into tiny spaces, all while cutting energy use. So far, however, the ability to build these monolithic 3D integrated circuits has proven […] The post 3D silicon circuits bring denser computer chips closer to reality appeared first on Science Tech Updates.