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Molex Launches Impress Co-Packaged Copper Solutions, Scaling Near-ASIC Connectivity Innovations to Meet Next-Generation Data Rate Demands
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Automation Update
Automation UpdateMolex Launches Impress Co-Packaged Copper Solutions, Scaling Near-ASIC Connectivity Innovations to Meet Next-Generation Data Rate Demands
Compression-based, on-substrate connector and cable assembly optimize signal integrity and efficient power distribution at speeds of 224Gbps PAM-4 and beyond Impress leverages insights and engineering expertise from NearStack OTS, with over one million units delivered to date Compact footprint and enhanced durability simplify maintenance and upgrades to future-proof high-density systems LISLE, IL – February 17, 2026 – Molex, a global electroni…
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