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Molex Accelerates AI Cluster Deployment with One-Stop Optical Interconnect Architecture and Debut of High-Radix Optical Circuit Switch Platform

• Combination of Molex VersaBeam EBO Backplane Connector and Teramount TeraVERSE detachable fiber connector boosts serviceability and slashes deployment time by 85%• Enhanced CPO toolkit with Versatile Format Interconnect and External Laser Source Small Form Factor Pluggable increase density by 50% and cut system power consumption• Molex High-Radix Optical Circuit Switch Platform improves GPU cluster scalability and efficiency by enabling larges…
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Automation Update broke the news in on Wednesday, March 18, 2026.
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