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Micron plans $24-billion memory chipmaking plant in Singapore

Micron's $24 billion, 10-year expansion will add 700,000 sq ft of cleanroom space and create about 1,600 jobs in fab engineering and operations, driven by AI demand.

  • On Jan. 27, 2026 Micron broke ground on an advanced wafer fabrication facility in Singapore, investing US$24 billion over 10 years at its existing NAND manufacturing complex for the country’s first double-storey fab.
  • AI-Driven demand has surged, increasing need for NAND technology as Micron described AI-fuelled demand as unprecedented and expects shortages to last beyond 2026 while clients negotiate multi-year agreements.
  • The expansion will create around 1,600 jobs and add approximately 700,000 square feet of cleanroom space, supporting about 3,000 Micron roles in Singapore.
  • Deputy Prime Minister Gan Kim Yong said the investment anchors Singapore's role in advanced NAND manufacturing and opens opportunities for local SMEs and workforce development through partnerships.
  • Wafer output is planned for the second half of calendar 2028, Micron says the HBM advanced packaging facility should contribute in calendar year 2027, and the company will pace capacity ramps to match demand.
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Benzinga broke the news in New York, United States on Monday, January 26, 2026.
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