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Micron Reportedly Developing Stacked GDDR to Address Shifting AI Memory Demand
6 Articles
6 Articles
As the first storage manufacturer in the world, the US company Micron Technology wants to stack the GDDR memory modules such as HBM, which are specifically intended for graphics cards and accelerators, into a "3D graphics memory".
Micron May Stack GDDR Like HBM For A Major Graphics Memory Capacity Boost
As the global AI boom continues to fracture the traditional semiconductor supply chain, manufacturers are searching for novel ways to increase memory density and throughput without the astronomical cost of flagship HBM solutions. According to ETNews, Micron has commenced development of a new product that will stack GDDR chips in a vertical
News extracted from HD Technology. Visit www.hd-tecnologia.com for the latest news. Artificial intelligence continues to advance and increasingly impacts the hardware you use every day. What was previously focused on gaming starts to change the priority, and the decisions of the big companies make it quite clear. In that context, Micron prepares something that can alter the balance of the market. The company seeks to transform the GDDR memory, k…
Micron May Be Planning On Making HBM-Style Stacked GDDR Memory
Micron is reportedly planning on developing vertically stacked GDDR memory products. The memory maker is said to have already started working on a new design for the model, with plans to install related equipment and have a working product using said memory out by the second half of this year. News of Micron’s alleged project were first reported by Korean outlet, ETNews, and that the semiconductor company is targeting AI accelerators for its sta…
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