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HUAWEI Presents the Tau Scaling Law, Enabling Breakthroughs in Transistor Density and System Performance
Huawei says the new framework has guided 381 chips and could help Kirin chips reach 1.4 nm-equivalent density by 2031.
- On Monday, He Tingbo, President of HUAWEI's Semiconductor Business Department, presented the Tau Scaling Law at the 2026 IEEE International Symposium on Circuits and Systems in Shanghai, proposing a framework shifting semiconductor optimization from transistor size to signal speed.
- Moore's Law, which guided the semiconductor industry for more than five decades, has faced severe physical limits and diminishing economic returns in recent years. He drew inspiration from Dujiangyan, an ancient irrigation system in Sichuan province built more than 2,000 years ago, to view constraints as engineering challenges.
- Over six years, HUAWEI has designed and mass-produced 381 chips based on this methodology, serving multiple industries. Kirin chips launching in fall 2026 will be the first to adopt the LogicFolding architecture, with projections showing transistor density equivalent to 1.4 nm processes by 2031.
- Tian Feng, director of Kuaisi Manxiang Research Institute, characterized HUAWEI's proposal as redefining performance evolution, stating "Huawei has redefined the yardstick of performance evolution, shifting the goal from transistor size to signal delay." Hu Yanping, professor at Shanghai University of Finance and Economics, noted the semiconductor industry approaches an AI-driven inflection point.
- Analysts suggest feasibility hinges on execution rather than theory alone, and broader adoption requires strengthened domestic EDA capabilities. He Tingbo emphasized the Tau Scaling Law represents a collective endeavor requiring worldwide scientific and industry collaboration to sustain semiconductor development.
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Huawei is putting pressure back into the semiconductor race, but this time not just talking about lithography, but how its future chips, be they CPU, GPU, SoC or accelerators, will be designed inside. The idea revolves around its Tau Law and Logic Folding, a technique that, as we saw two days ago, aims to take logic from traditional 2D design to a 3D reconstruction at standard cell level, with the University of Beijing providing an EDA tool for …
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