Intel CEO to Visit India for Ground-Breaking Ceremony of Semiconductor Plant

Intel CEO likely to visit Odisha for ground breaking ceremony of semiconductor plant; chip production to begin in 2 years

Odisha is set to become a major hub for semiconductor manufacturing with the groundbreaking ceremonies for two new plants. Intel CEO Lip-Bu Tan is expected to visit for the 3D Glass Solutions' plant, backed by Intel and Lockheed Martin.

Intel CEO to visit India for ground-breaking ceremony of semiconductor plant

The CEO of PC chip giant Intel, Lip-Bu Tan, is expected to visit Odisha later this year for the groundbreaking ceremony of 3D Glass Solutions' semiconductor plant, a senior state government official said on Wednesday. Speaking to PTI, Principal Secretary of the Odisha Electronics and IT Department, Vishal Kumar Dev, stated that the groundbreaking ceremony for the silicon carbide company SicSem is scheduled for next month, with commercial chip pr…

Intel CEO Lip-Bu Tan Likely To Attend 3DGS Ground-Breaking Ceremony In Odisha

New Delhi/Bhubaneswar: Intel CEO Lip-Bu Tan is expected to visit Odisha later this year for the ground-breaking ceremony of 3D Glass Solutions’ semiconductor plant.  The US chip major-backed 3D Glass semiconductor manufacturing unit in Odisha will be set up by Heterogeneous Integration Packaging Solutions Pvt Ltd, entailing an investment of Rs 1,943 crore with an annual production capacity of 5 crore units. This is the first semiconductor projec…