Odisha Gets India’s First 3D Glass Chip Packaging Plant

Odisha gets India’s first 3D glass chip packaging plant

The facility set up by US-based 3D Glass Solutions Inc. (3DGS) at Info Valley in Bhubaneswar is worth ₹1,943 crore

CM to lay stone for country’s 1st advanced chip packaging unit today

Bhubaneswar: Odisha’s capital city will host India’s first advanced 3D glass semiconductor packaging unit, with chief minister Mohan Charan Majhi set .

Odisha emerges as fast-growing IT and semiconductor hub with strong electronics manufacturing push: Union Minister Ashwini Vaishnaw

Bhubaneswar: In a defining moment for India’s semiconductor ambitions and Odisha’s emergence as a future-ready technology destination, the foundation stone for the country’s first advanced 3D chip packaging unit was laid today at Info Valley, Bhubaneswar. The project marks a significant step towards strengthening India’s domestic semiconductor ecosystem and advancing the vision of Atmanirbhar Bharat in high-end electronics manufacturing. The fou…

Foundation stone laid for India's first advanced 3D chip packaging unit in Odisha's Info Valley

Union Minister for Electronics & IT Ashwini Vaishnaw said that the foundation stone of a semiconductor plant has been laid in Odisha on the occasion of Akshay Tritiya. He said the upcoming facility marks a significant step for high-tech manufacturing in the state, adding that he thanked Prime Minister Narendra Modi and Odisha Chief Minister Mohan Charan Majhi.

Groundbreaking of India’s First Advanced 3D Semiconductor Packaging Unit in Odisha; Major Boost to AI, 5G and Defence Tech, Odisha Poised to Power PM Modi’s Vision of Making India Self-Reliant in Semiconductor and Electronics Manufacturing: CM Mohan Chara

By Our Correspondent BHUBANESWAR:In a defining moment for India’s semiconductor ambitions and Odisha’s emergence as a future-ready technology destination, the foundation stone for the country’s first advanced 3D chip packaging unit was laid today at Info Valley, Bhubaneswar. The project marks a significant step towards strengthening India’s domestic semiconductor ecosystem and advancing the vision of Atmanirbhar Bharat in high-end electronics ma…

India’s First Advanced 3D Chip Packaging Unit Launched in Odisha, Boosting AI and Semiconductor Ambitions - Business News Week

Bhubaneswar, April 19 (BNP): In a major step towards strengthening India’s semiconductor ecosystem, the foundation stone for the country’s first advanced 3D semiconductor packaging unit was laid at Info Valley in Bhubaneswar on Saturday. The project, promoted by 3D Glass Solutions, marks a significant milestone in India’s push for self-reliance in high-end electronics manufacturing under […] The post India’s First Advanced 3D Chip Packaging Unit…