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Industry Leaders Provide Insights And Guidance On Multi-Die Designs - Data Intelligence
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Industry Leaders Provide Insights And Guidance On Multi-Die Designs - Data Intelligence
Multi-die designs seamlessly integrate multiple heterogeneous or homogeneous dies in a single package to significantly enhance chip performance and efficiency — making them indispensable for high-performance computing (HPC), artificial intelligence (AI), data analytics, advanced graphics processing, and other demanding applications. While representing a groundbreaking leap forward, multi-die designs also introduce a host of engineering challenge…
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