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Huawei proposes new path for chip development amid US sanctions

Huawei said the Tau Scaling Law could help it improve performance and chip density despite U.S. sanctions, after mass-producing 381 chips already.

  • On Monday, Huawei Technologies announced plans to design high-end chips by 2031 with transistor density equivalent to 1.4-nanometre processes using its new Tau Scaling Law, despite sanctions restricting China's semiconductor access.
  • He Tingbo, president of Huawei's semiconductor business, introduced the concept at the IEEE International Symposium on Circuits and Systems in Shanghai, explaining that the Tau Scaling Law cuts signal and data movement time through chips.
  • Huawei has mass-produced 381 chips over the past six years using this scaling method for smartphones and AI computing. The firm's Kirin chips launching in fall 2026 will feature LogicFolding architecture to shorten internal wiring.
  • Although Huawei provided no independent performance data to verify its projection, the 1.4-nanometre target remains significant as it nears the global frontier for advanced chipmaking expected around decade's end.
  • Washington's restrictions on advanced lithography tools make it unlikely China can reach such manufacturing levels alone, positioning this alternative scaling approach as a strategic response to geopolitical barriers in semiconductor development.
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Huawei Switches Lane... Chasing TSMC and Samsung with Tao's Law. With a new Law of Tao (τ), we aim to achieve high-performance semiconductor integration density equivalent to the 1.4 nanometer (nm) process by 2031. At the 2026 International Conference on Circuits and Systems held in Shanghai, China on the 25th...

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Huawei claims it will make cutting-edge semiconductors by 2031

The company said its next-gen chips will be "feasible and affordable."

·United States
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Blue Water Healthy Living broke the news in Port Huron, United States on Sunday, May 24, 2026.
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