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Samsung Completes Development of 1c DRAM, Paving Way for HBM4 Rollout
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2 Articles
Samsung completes development of 1c DRAM, paving way for HBM4 rollout
Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product has received internal Production Readiness Approval (PRA), signaling it has met key quality and performance benchmarks and is now in the final phase before mass production. The milestone brings Samsung one step closer to its goal of mass-producing HBM4, or fourth-generation high-bandwidth memory, in the second…
[Digital Daily Reporter Bae Tae-yong] Hanmi Semiconductor has started mass production of the bonding equipment 'TC Bonder 4' for the next-generation high-bandwidth memory (HBM4). As the global semiconductor industry is preparing for mass production of HBM4, Hanmi Semiconductor's strategy is to continue its dominance in the bonding equipment market with equipment optimized for HBM4. On the 4th, Hanmi Semiconductor announced that it will convert …
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