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Exclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plans
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Exclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plans
The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck globally. According to supply chain sources, TSMC will add a P2 fab at its Southern Taiwan Science Park AP8 site, with both fabs focusing on CoWoS technology. Meanwhile, the Chiayi AP7 facility, originally planned for WMCM, SoIC, and CoPoS packaging, will switch…
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