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Supermicro Signs MoU With Ericsson To Advance Enterprise Connectivity For Edge AI Systems

  • On June 10, 2025, Ericsson and Supermicro announced their intention to collaborate on enhancing enterprise connectivity for Edge AI solutions across various industry sectors.
  • The agreement followed growing demand for Edge AI solutions requiring low-latency processing where wired technologies are not viable, such as smart intersections and industrial sites.
  • The collaboration will combine Ericsson’s 5G wireless WAN and security technologies with Supermicro’s diverse Edge AI compute platforms into unified commercial bundles.
  • Mory Lin of Supermicro explained that the collaboration will enable businesses to deploy their AI solutions in locations where traditional wired connections are impractical, by leveraging built-in 5G connectivity.
  • These commercial bundles aim to simplify deployment of Edge AI infrastructure in retail, healthcare, factories, and public sectors by delivering pre-validated AI compute with 5G connectivity.
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Manufacturing AUTOMATION broke the news in on Tuesday, June 10, 2025.
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