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E&R Engineering to Feature Advanced Packaging and CPO Innovations at ISIG 2026

E&R Engineering Corp. will participate in the International Semiconductor Industry Group Symposium on Monday and Tuesday at the Plug and Play Tech Center in Sunnyvale, California.
The company will showcase Advanced Packaging and Co-Packaged Optics innovations designed for High-Performance Computing and artificial intelligence applications, reflecting industry demand for next-generation semiconductor technologies.
Technical highlights include Fan-Out Panel Level Packaging supporting 700 mm panels with warpage control up to 16 mm, plus Through-Glass Via innovations enabling high-density interconnects on glass substrates.
The symposium participation follows E&R's second North American site opening in Hillsboro, Oregon, positioning the company to bridge Taiwanese engineering expertise with the North American supply chain for localized support.
Automation Integration Service has already secured significant North American orders and is positioned as a major revenue driver extending order visibility through 2027 for global industry leaders.

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E&R Engineering to Feature Advanced Packaging and CPO Innovations at ISIG 2026

KAOHSIUNG, April 15, 2026 /PRNewswire/ -- E&R Engineering Corp. (8027.TW), a leading provider of innovative semiconductor process equipment, will participate in the International Semiconductor Industry Group (ISIG) Symposium, April 20–21, at the Plug and Play Tech Center in Sunnyvale, California.

4 days ago·Missoula, United States

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