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DuPont Powers AI and Next-Gen Electronics with Advanced Interconnect Innovations at JPCA Show 2025
- DuPont announced on June 3, 2025, it will showcase advanced interconnect solutions at JPCA Show 2025 from June 4-6 in Tokyo.
- This participation responds to the surging demand for high-performance IC substrates driven by AI ecosystem growth and Japan's material innovations.
- DuPont’s portfolio at Booth #6C-03 includes technologies like Circuposit electroless copper for AI chips, Microfill acid coppers, Riston photoresists, and Pyralux laminates.
- Yuan Yuan Zhou, who leads Advanced Circuit & Packaging at Interconnect Solutions, emphasized that their involvement in JPCA 2025 highlights the company’s dedication to driving innovation in the electronics sector.
- DuPont’s solutions empower manufacturers to accelerate product development and enhance efficiency, supporting growth in advanced packaging and next-generation electronics.
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Rutland Herald+58 Reposted by 58 other sources
DuPont Powers AI and Next-Gen Electronics with Advanced Interconnect Innovations at JPCA Show 2025
TOKYO, June 3, 2025 /PRNewswire/ -- DuPont (NYSE:DD) today announced its participation in the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025), taking place from June 4-6 at the Tokyo Big Sight East Exhibition Halls. At Booth #6C-03,…
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Leaning Left6Leaning Right6Center19Last UpdatedBias Distribution61% Center
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