Chip interconnect startup Kandou AI raises $225M in funding

Chip interconnect startup Kandou AI raises $225M in funding

Kandou AI Inc., a developer of copper-based interconnects for artificial intelligence chips, has raised $225 million in funding. Bloomberg reported today that the investment values the company at $400 million. The round was backed by Synopsys Inc. and Cadence Design Systems Inc., two publicly-traded providers of chip development software. They were joined by semiconductor designer […] The post Chip interconnect startup Kandou AI raises $225M in …