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China's Huawei to launch two new AI chips in 2027

Huawei said the Ascend 960 family will double computing power from the previous generation as it builds larger systems to challenge Nvidia.

  • On Thursday, Huawei Technologies rotating chairman Wang Tao will present the upcoming Ascend 960 AI chips at the company's annual summit in Shanghai, advancing the firm's ambition to replace Nvidia in China.
  • Defying US export controls that cut it off from advanced memory products from Hynix, Samsung Electronics, and US-based Micron Technology, Huawei is spearheading Beijing's drive for self-sufficiency in critical technologies.
  • To compete despite trade curbs, the firm introduced a SuperPod structure linking 100,000 Ascend chips via its UnifiedBus networking protocol, joining techniques like LogicFolding to narrow the gap with Nvidia.
  • DeepSeek plans to deploy at least 160,000 Huawei Ascend 950DT chips in Inner Mongolia, though production constraints limit the firm's ability to satisfy explosive demand in a market Morgan Stanley estimates could reach 646 billion yuan.
  • Aiming to double computing power with each new generation of chips, Huawei plans an upgraded Ascend 970 iteration for 2028 and is exploring foreign markets including Malaysia and Egypt.
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Huawei unveils new chip technologies as Chinese firm steps up the AI race with Nvidia

Chinese technology giant Huawei has launched new chip technologies as it challenges leading global companies such as Nvidia

·New York, United States
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Shanghai, China, Sept. 17 (EFE).- Chinese technology Huawei launched its new cluster for Ascend 960 SuperPoD computing and other technologies it seeks to compete with the American Nvidia in Infrastructure for Artificial Intelligence (IA), a goal it officially advertised this week. During the Huawei Connect 2026 technology conference, held in [...] The Huawei entry presents a new range of clusters for AI with which it seeks to compete with Nvidia…

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Times of India broke the news in India on Wednesday, September 16, 2026.
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