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Odisha Collaborates with Intel, 3DGS for Major Semiconductor Facility

The plant is expected to create more than 1,800 direct high-skilled jobs and support AI, high-performance computing and telecommunications.

  • On Friday, the Odisha government signed an MoU with Intel Corporation and 3DGS Inc. to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar-Khurda region.
  • Approved under the India Semiconductor Mission, this initiative aims to localize supply chains by providing billions in subsidies to pull chip manufacturing onshore, reducing India's historic reliance on imports.
  • The $3.3 billion project targets creating more than 1,800 direct high-skilled jobs while producing around 70,000 glass substrates annually, alongside 50 million assembled units and 13,000 advanced 3D heterogeneous-integration modules.
  • For Intel, the facility represents a strategic investment in advanced packaging, allowing the corporation to plant a manufacturing flag in a fast-growing market without the tens of billions a full fabrication plant requires.
  • Positioned within a global semiconductor shift, the five-to-six-year project mirrors strategic policies like the EU and CHIPS Acts that aim to localize dangerously concentrated supply chains.
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prokerala.com broke the news on Friday, May 29, 2026.
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