Odisha Collaborates with Intel, 3DGS for Major Semiconductor Facility
The plant is expected to create more than 1,800 direct high-skilled jobs and support AI, high-performance computing and telecommunications.
- On Friday, the Odisha government signed an MoU with Intel Corporation and 3DGS Inc. to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar-Khurda region.
- Approved under the India Semiconductor Mission, this initiative aims to localize supply chains by providing billions in subsidies to pull chip manufacturing onshore, reducing India's historic reliance on imports.
- The $3.3 billion project targets creating more than 1,800 direct high-skilled jobs while producing around 70,000 glass substrates annually, alongside 50 million assembled units and 13,000 advanced 3D heterogeneous-integration modules.
- For Intel, the facility represents a strategic investment in advanced packaging, allowing the corporation to plant a manufacturing flag in a fast-growing market without the tens of billions a full fabrication plant requires.
- Positioned within a global semiconductor shift, the five-to-six-year project mirrors strategic policies like the EU and CHIPS Acts that aim to localize dangerously concentrated supply chains.
17 Articles
17 Articles
Odisha Collaborates with Intel, 3DGS for Major Semiconductor Facility
The Odisha government has teamed up with Intel and 3DGS to establish a landmark semiconductor packaging facility in Bhubaneswar. With a $3.3 billion investment, the venture aims to boost India's semiconductor capabilities and create over 1,800 high-skilled jobs.
Intel, 3DGS to set up $3.3 billion substrate plant in Odisha
Union Minister of Electronics and IT Ashwini Vaishnaw along with Odisha Chief Minister Mohan Charan Majhi, Intel CEO Lip-Bu Tan, and other dignitaries witnessed the signing of the MoU to bring substrate manufacturing technology to India.
Intel, 3DGS to set up $3.3 billion substrate plant in India's Odisha state
NEW DELHI, May 29 : U.S. chipmaker Intel and 3DGS Inc. USA will invest about $3.3 billion to set up a substrate manufacturing plant in the eastern Indian state of Odisha, the Indian government said on Friday.Here are some details:• The project is expected to create more than 1,800 direct high-skilled
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