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AT&S to open Europe's first advanced IC substrate facility in June
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AT&S to open Europe's first advanced IC substrate facility in June
AT&S is preparing to open a new high-tech production facility for advanced IC substrates and packaging technologies in Leoben, Austria. Set to officially launch in June 2025, the site will be the first of its kind in Europe and is expected to play a key role in strengthening Europe's microelectronics supply chain.
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