AMD Instinct MI350 GPUs with 288GB HBM3E and 1400W TDP Announced

AMD Instinct MI350 GPUs with 288GB HBM3E and 1400W TDP Announced

AMD has unveiled its latest Instinct MI350 series GPUs designed specifically for data center AI tasks. These new GPUs use the CDNA 4 architecture and are built mostly on TSMC’s cutting-edge 3nm process technology, combined with 6nm chips handling memory interfaces and cache.

AMD Instinct MI350 Launched: 3nm, 185 Billion Transistors, 288 GB HBM3E Memory, FP4 & FP6 Support, MI355X 35x Faster Than MI300 & 2.2x Faster Than Blackwell B200

AMD has officially launched its next-gen Instinct MI350 series, which includes the MI350X and the flagship MI350X, with up to 185 billion transistors. AMD Instinct MI350 Powers Next-Gen AI With Brand New 3nm Process Node, 20 PFLOPs of AI Compute & New Format Support Today, AMD has officially launched its Instinct MI350 series of HPC / AI GPUs, which come equipped with a brand new CDNA 4 architecture based on TSMC's 3nm process node. The chip its…