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AMD advances space-grade compute portfolio with new Class Y packaging

Summary by Industrial News
AMD has moved to expand its space-grade compute line-up, qualifying a new organic lidless package for its Versal AI Core XQRVC1902 adaptive SoC and extending space-flight ambitions out to 15 years. The packaging — engineered to withstand thermal and mechanical extremes — is being positioned for geosynchronous satellites, lunar programmes, and deep-space probes, and is undergoing Class Y qualification under MIL-PRF-38535. The update forms part of…
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Industrial News broke the news in on Wednesday, November 26, 2025.
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