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Broadcom CEO Says Biggest Hurdle in AI-Fuelled Tech Growth Is Capital, Not Memory Chips

Executives said rising borrowing costs and capital access could slow AI infrastructure spending as companies seek returns from heavy investment.

  • Broadcom CEO Hock Tan and Intel CEO Lip-Bu Tan warned on Monday that capital has become the biggest constraint facing the technology industry as artificial intelligence development accelerates.
  • Recurring supply bottlenecks over the past two years are easing as production capacity expands, but Hock Tan noted that capital constraints now present the biggest challenge.
  • "There is more demand for compute infrastructure than we can supply," Hock Tan said, adding the imbalance could persist through 2029 and potentially into 2030.
  • Intel CEO Lip-Bu Tan emphasized that companies must increasingly demonstrate tangible returns from artificial intelligence investments through improved efficiency and new business models.
  • Rising borrowing costs threaten to complicate funding for data center construction and chip purchases, though executives expect demand for computing infrastructure to remain strong through 2029.
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Broadcom CEO says biggest hurdle in AI-fuelled tech growth is capital, not memory chips

·London, United Kingdom
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Broadcom CEO Hock Tan said during a panel discussion in Singapore on Monday that the company’s biggest bottleneck as it continues to develop artificial intelligence is a lack of capital. We’ll be covering similar topics at our Portfolio Investment Day conference on October 21. One of the biggest investment events of the year is coming up, where professional experts will tell you what to invest in now. Register here.

·Budapest, Hungary
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Intel and Broadcom point out that cost and access to capital could limit the expansion of AI infrastructure, although they expect computing demand to continue to exceed supply for several years.

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WTVB broke the news on Monday, October 12, 2026.
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